Record-breaking chip sidesteps Moore’s law by growing upwards

A new chip design includes 41 vertical layers of semiconductor and insulator materials, which allow it to outrun the limits of miniaturisation

​A new chip design includes 41 vertical layers of semiconductor and insulator materials, which allow it to outrun the limits of miniaturisation A new chip design includes 41 vertical layers of semiconductor and insulator materials, which allow it to outrun the limits of miniaturisation